International Conference on IC Design and Technology

ICICDT 2016 Home


Austin, Texas, USA

May 23rd - 25th, 2017


Paper Submission Deadline February 1st, 2017

On behalf of the technical program and organizing committees, we welcome you to the 2017 IEEE International Conference on Integrated Circuit Design and Technology (ICICDT) which will be held in Austin, Texas on May 23rd - 25th, 2017. Integrated circuit (IC) engineering roles have traditionally been separated along the boundary between design and technology. As IC products advance toward higher performance with better energy efficiency and ultra-low voltage operation for upcoming hot applications as internet of thing (IoT) and autonomous cars, while the cost control and time to market continue to be mandated, thus future IC engineers will require a deeper understanding of the interdependencies between design and technology options to expand the product optimization window. ICICDT is the forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary through interactions with design, technology, and process experts to develop the skills for future IC research and development.

The unique workshop style of the conference fosters an environment for exchanging breakthrough ideas/findings and collaborating effectively. A one-day tutorial program aims on the current hot topics for both the beginner and expert precedes two days of technical presentations and workshops. The 2017 ICICDT topics include:

  • Advanced materials and processing technologies
  • Advanced transistor and interconnect structures
  • Interposer/Three-Dimensional (2.5D/3D) integration
  • Variation-tolerant designs
  • Process and design techniques for soft errors, plasma-induced damage, and reliability
  • Advanced memory devices and circuits
  • RF, analog, mixed signal, and I/O circuits for future technology generations
  • Simulation and modeling of advanced processes, devices, and circuits
  • EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
  • Design for manufacturing, yield, and test
  • System-on-Chip (SoC) and system-in-package (SiP) design integration
  • Power semiconductor technologies and circuits
  • Emerging technologies, circuits and Applications (Internet of Thing, Autonomous cars)

2017 Conference Chair:
Bich-Yen Nguyen (Soitec,